Mycronic

Flexible PCB Assembly Solutions

Mycronic is a globally leading manufacturer and technology provider of flexible PCB assembly solutions. The company delivers end-to-end production line solutions to electronics manufacturers through its high-precision printing, placement, inspection, material handling, and process software technologies, specifically developed for high-mix SMT production environments with frequent product changeovers.

Headquartered in Täby, near Stockholm, Sweden, Mycronic operates with approximately 2,200 employees across 12 countries and supports customers in more than 50 countries through local offices, subsidiaries, and distributor networks. With over 35,000 production systems installed worldwide, more than 50 years of innovation experience, and a technology portfolio comprising over 400 patents, Mycronic is recognized as one of the industry’s leading pioneers.

Mycronic’s PCB Assembly Solutions division offers a comprehensive product portfolio for SMT lines requiring high flexibility, including jet printing, stencil printing, solder paste inspection (3D SPI), component placement, 3D AOI, intelligent component storage, and process software. These solutions are designed to help manufacturers with high-mix product portfolios and frequent NPI (New Product Introduction) and changeover requirements remain competitive in terms of both quality and cost.

Mycronic’s R&D centers are located across Europe, North America, and Asia, with activities spanning five main product areas: PCB assembly, photomask equipment, dispensing & coating, bare board testing, and die bonding. Within PCB assembly, the primary focus is on developing data-driven “smart factory” solutions that address electronics manufacturers’ demands for flexibility, precision, traceability, and sustainability.

As the authorized distributor of Mycronic’s PCB Assembly Solutions product group in Türkiye, Merit Elektronik not only supplies Mycronic equipment but also delivers end-to-end solutions including production line design, process optimization, training, and long-term technical support.

Company website: https://www.mycronic.com/

Mycronic > Solutions

Mycronic PCB Assembly Solutions – Smart, Integrated, and Data-Driven SMT Manufacturing

Mycronic’s PCB assembly solutions approach goes beyond offering individual SMT machines; it delivers an integrated production architecture encompassing printing, placement, optical inspection, material handling, and software layers. This architecture is designed to provide reliable and efficient PCB assembly across a wide range of applications, from simple prototype lines to high-mix production environments requiring full traceability in defense, automotive, medical, and industrial manufacturing.

Mycronic solutions focus on:

  • Managing complexity in production processes,
  • Making line planning and capacity utilization transparent and predictable,
  • Standardizing operator-dependent processes through software and automation,
  • Increasing Overall Equipment Effectiveness (OEE) while reducing defects, rework, and scrap rates.

GenI™ Generative AOI Programming is a next-generation programming approach developed to eliminate the traditional requirement of manually creating a new AOI program for each product in 3D AOI systems.

With this solution:

  • The need to create separate AOI programs for each new product is significantly reduced, as inspection rules are automatically generated using data-driven generative models.
  • The NPI (New Product Introduction) process is accelerated, dramatically shortening the time required to bring AOI online during prototyping and initial production runs.
  • True 3D metrology infrastructure enables measurable and traceable 3D inspection criteria, moving beyond simple visual OK/NOK decisions.

As a result, GenI transforms AOI programming from a manual, expertise-intensive task into a semi-automatic or fully automatic model-driven production process. This delivers both engineering time savings and a scalable quality control infrastructure as product variety increases.

Deep Review is Mycronic’s AI-based Automatic Defect Classification (ADC) solution developed for its 3D AOI systems.

In conventional AOI scenarios, a large number of “false calls” (points that are actually good but flagged as defects) may be generated, resulting in significant operator workload.

Deep Review:

  • Automatically classifies defect images generated after inspection using AI-driven models,
  • Eliminates the majority of false calls, significantly reducing operator review time,
  • Continuously improves its defect classification accuracy through a learning model; as manufacturers correct labels, the system becomes progressively more intelligent.

As a result, the common dilemma of “wanting comprehensive inspection coverage but being constrained by false call workload” is largely eliminated, enabling a balanced combination of high inspection coverage and acceptable review effort.

Mycronic’s MX7 mounthead technology is the core placement head solution at the heart of the next-generation MYPro A40 pick-and-place machines.

This technology enables:

  • Up to 48% higher speeds compared to the previous generation, increasing production capacity and allowing more work to be processed on the same machine platform,
  • High speed and high precision across a significantly broader component spectrum, enabling a single head to handle a wider range of components instead of relying on specialized heads in high-mix production environments.

In summary, MX7 strengthens the flexibility–speed balance and elevates line capacity to a new level within the same production footprint.

Mycronic positions its new graphical user interface (GUI) for pick-and-place machines as a user-centric design developed directly in collaboration with line operators and process engineers.

This new interface:

  • Accelerates access to daily functions through an intuitive, touchscreen-based menu structure,
  • Presents critical line data (such as production speed, defect distribution, feeder status, etc.) at a glance, bringing process data directly to the shop floor,
  • Minimizes the risk of misconfiguration by making setup and configuration steps nearly error-proof.

As a result, operator training times are reduced, while experienced personnel can focus on more strategic tasks on the production line.

Iris 3D Vision Technology is Mycronic’s next-generation imaging infrastructure developed for its 3D AOI platforms.

With this technology:

  • Shorter cycle times are achieved in 3D AOI, enabling faster full-board inspection,
  • High-resolution 3D data allows more reliable analysis of fine solder structures, fine-pitch components, and complex topographies,
  • Enhanced image processing quality increases true defect detection rates while enabling more refined control of false calls.

The result is a balanced combination of speed, resolution, and intelligence within the AOI process.

When introducing new products in 3D AOI, a common challenge arises:

  • Tightening inspection rules increases false calls,
  • Loosening rules reduces false calls but increases the risk of escaped defects.

To mitigate this “ping-pong effect,” Mycronic introduces an automatic programming assistant called Escape Tracker.

Escape Tracker:

  • Systematically monitors the impact of parameter changes in 3D inspection models on both escaped defects and false calls,
  • Converts historical cases and parameter adjustments into a learned knowledge base for future programming decisions,
  • Enables AOI engineers to make more refined decisions based on accumulated system knowledge rather than repeatedly performing the same optimization steps.

This approach both accelerates AOI programming and makes the process more predictable.

Mycronic 4.0 is an integrated and agile manufacturing solution designed to address the complexity of modern electronics production.

This solution:

  • Supports a just-in-time production philosophy by ensuring the right material is available at the right line at the right time,
  • Consolidates line management, inventory tracking, and production planning into a single data- and automation-driven structure,
  • Targets 100% inventory accuracy by providing real-time visibility into component location, lot, and condition.

Mycronic 4.0 positions the SMT line as the digital core of a factory that is fully digitized end to end across:

  • Planning,
  • Material management,
  • Production execution,
  • Quality and traceability.

Mycronic’s jet printing solutions aim to bring the concept of the “perfect solder joint” into practical manufacturing.

With jet printing technology:

  • The required solder paste volume for each component can be independently and precisely controlled, enabling component-specific deposition instead of applying an average volume from a single stencil,
  • Common stencil printing issues such as clogging, wear, pad bridging, and cleaning requirements are minimized,
  • High-speed solder paste dispensing delivers flexibility for small batches while maintaining high efficiency in large-volume production.

In short, jet printing adds a technology layer that improves solder joint quality even in demanding applications while reducing errors caused by incorrect dosage and stencil-related limitations.

Mycronic’s material handling approach aims to be one of the most accurate and least error-prone systems in the industry when it comes to inventory accuracy and material traceability.

These solutions:

  • Automate component in/out transactions to reduce operator-related errors,
  • Integrate seamlessly with MYTower and line software to provide clear visibility of stock accuracy and material flow,
  • Transform material management from a typical high-mix production pain point into a simplified and transparent process.

As a result, common issues such as material shortages, incorrect component usage, and components appearing in inventory but not physically available are minimized.

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Merit Elektronik and Mycronic PCB Assembly Solutions

At Merit Elektronik, we integrate all of these advanced technologies under Mycronic’s PCB Assembly Solutions portfolio—including GenI AOI programming, Deep Review ADC, MX7 mounthead, the new pick-and-place interface, Iris 3D Vision, Escape Tracker, Mycronic 4.0, jet printing advantages, and intelligent material handling—into the production lines of manufacturers across Türkiye.

Beyond equipment supply, we provide:

  • Production line concept and layout design,
  • Definition of process and quality strategies,
  • Operator and engineer training,
  • Long-term technical support and service.

We support you in building fully controllable, data-driven SMT production lines from start to finish.

Mycronic – End-to-End Line Architecture from Printing to Storage

In the field of surface mount technology (SMT), Mycronic delivers line-based solutions that integrate printing, placement, optical inspection, material storage, and process software within a single ecosystem. Rather than treating PCB assembly as isolated stations, Mycronic SMT machines approach the process as a fully visible, traceable, and optimizable production chain.

With this approach, manufacturers can achieve:

  • Rapid product changeovers even in high-mix product portfolios,
  • Component-level traceability and accurate inventory control,
  • Predictable line availability through predictive maintenance and live performance monitoring,
  • High first-pass yield (FPY) production of more compact, complex, and high-density PCBs,

—all under a single brand ecosystem.

Mycronic SMT Product Portfolio

  • Stencil Printing – MYPro S Series
  • Jet Printing – MY700 Series
  • 3D Solder Paste Inspection – PI Pico/PI Primo
  • Component Placement – MYPro A & MY300 Series
  • 3D AOI – MYPro I Series
  • Component Storage – MYTower Series
  • Process Software – Assembly Process Management Software Suite

Key Principles for Improving Efficiency and Quality in SMT Production Lines

1.1. Real-Time Visibility Across the Entire Process (Full Visibility Planning)

Mycronic SMT systems collect and visualize production data in real time across the entire line, enabling production engineers to monitor the complete line from a single interface. Cycle times per product, downtime events, defect types, and production flow can be reported through interfaces that integrate with MES or data analytics platforms.

This enables:

  • Data-driven line balancing decisions,
  • Rapid identification and elimination of bottlenecks,
  • More realistic planning, forecasting, and capacity utilization scenarios.

The result is higher Overall Equipment Effectiveness (OEE) and reduced scrap rates.

Within the Mycronic architecture, components are tracked not only in inventory but throughout all movements within the production line. Materials at reel, tray, or box level are digitally monitored from line-side storage and MYTower systems through to the pick-and-place machines.

This structure is particularly critical for:

  • Automotive, defense, medical, and aerospace projects requiring lot- or batch-level traceability,
  • Moisture-sensitive components where humidity exposure and floor-life tracking are mandatory.

Comprehensive backward traceability reports can be generated, detailing exactly which component from which lot was used on each individual PCB.

In high-mix production environments, one of the largest sources of productivity loss is setup and changeover time. Mycronic addresses this challenge through high feeder capacity, intelligent line balancing software, and MYTower-integrated material preparation, enabling multiple product changeovers within the same shift with minimal line downtime.

Through automatic program loading, shared feeder placement strategies, and dedicated material preparation areas, product changeovers become less dependent on operator experience and more reliant on standardized, software-driven procedures.

Through integration between MYTower systems and pick-and-place machines, the system predicts upcoming reel depletion times in advance and prepares the required materials for the operator. This significantly reduces line stoppages caused by material shortages.

At the same time, this level of automation improves inventory accuracy and reduces the need for excessive safety stock, thereby lowering overall inventory costs.

SMT equipment operates in an integrated manner with advanced vision systems, 3D SPI, and 3D AOI to maintain control over all critical quality points—from solder joints to component alignment. Line data is further utilized for predictive maintenance algorithms and performance trend analysis, minimizing unplanned downtime.

The intelligent material handling concept optimizes the flow of components between storage, the production line, and machines, reducing unnecessary material movement and waste. When reel change points, material routes, and storage strategies are managed by software, operator contribution to value-added production increases, and the line becomes more stable and predictable.

Mycronic > Products

2.1. Mycronic MYPro S Series – Stencil Printing

The Mycronic MYPro S Series (MYPro S20 and S30) is a family of stencil printers designed to optimize solder paste printing with a focus on high precision, repeatability, and speed. While supporting high-volume production with cycle times as low as 14 seconds, the series ensures stable and consistent print quality by maintaining the physical properties of solder paste through an advanced vision system and integrated climate control.

Key technical features:

  • Advanced vision & alignment: Intelligent camera systems and adjustable lighting ensure precise alignment between stencil and PCB, with support for dedicated reference features on pads ranging from 0.5 to 3 mm.
  • Closed-loop squeegee pressure control: Squeegee pressure is continuously monitored during printing; deviations are displayed on-screen, enabling immediate operator intervention.
  • Integrated 2D inspection & SPC: Post-print 2D inspection on every board combined with Statistical Process Control (SPC) enables continuous monitoring of print quality trends.
  • Robust mechanical design: A rigid chassis with granite support beams, dual ball screws, and dual-rail transport delivers ±8 µm repeatability and long-term stability.
  • Fast setup and automatic cleaning: Short setup times, automatic stencil cleaning cycles, and a user-friendly interface reduce operator workload.

The MYPro S Series combines Mycronic’s precision with the performance expected from modern stencil printing, delivering a single scalable stencil printing platform ready for future production demands.

The Mycronic MY700 is a contactless jet printing system that deposits solder paste and assembly fluids (such as adhesives and coatings) point by point without the use of a stencil. As PCBs become smaller and component density increases, MY700 addresses the limitations of conventional stencil printing—especially for complex board geometries, very small components, frequent product changes, and high-mix production environments.

By jetting solder paste directly from nozzles instead of using a stencil, MY700 delivers greater flexibility and control for prototypes, small batches, cavity boards, flexible PCBs, package-on-package assemblies, and sensitive applications such as 01005 components and fine-pitch BGAs.

Key highlights:

  • Fully software-controlled, stencil-free process: All printing parameters are managed via software, eliminating stencil manufacturing, replacement, and cleaning. This significantly shortens new product introduction (NPI) lead times.
  • Optimized for challenging boards: Precise, pad-by-pad volume control is achieved even for ultra-small components (01005, fine-pitch BGAs), QFNs, connectors, flexible boards, and recessed areas.
  • High speed with dual-head architecture: Dual jet heads and dual-lane capability enable high-speed deposition of both small and large solder volumes on the same PCB; a single machine can independently dispense solder paste and assembly fluids.
  • Micrometer-level precision: Accurate control of droplet position and volume improves solder joint quality while reducing rework, repair, and scrap.
  • Easy setup and automatic compensation: Fast program generation from CAD/Gerber data, reference and barcode reading, and board warpage/bending compensation reduce operator errors and improve line continuity.

MY700 stands out as Mycronic’s jet printing solution that combines high flexibility, high speed, and high solder joint quality on a single platform—particularly where stencil printing reaches its limits.

The Mycronic PI Series 3D SPI systems (PI Pico / PI Primo) measure solder paste not merely as a presence/absence check, but in terms of height, volume, and shape using true 3D inspection. The objective is to precisely control solder paste before solder joint formation, detecting issues such as bridging, insufficient or excessive paste, and shape deformation at the earliest stage of the line.

The PI Series employs high-resolution cameras, a multi-projection 3D engine, and patented Z-referencing technology to establish a reference surface across the entire PCB and perform measurements without pad cropping. This ensures reliable 3D data even with varying board thicknesses, warpage, and bending.

Key features:

  • True 3D measurement: Measures height, area, volume, offset, bridging, and 2D/3D shape parameters for each pad, providing clear numerical data toward achieving the “perfect solder joint.”
  • High accuracy and repeatability: High-megapixel CMOS sensors combined with multi-projection 3D engines and advanced Z-referencing deliver reliable results, particularly on small pads and fine-pitch areas.
  • Automatic programming & pad grouping: Intelligent software functions simplify SPI program creation and automatic pad grouping, reducing operator dependency and accelerating NPI processes.
  • SPC and process monitoring: Online SPC alerts notify users of process drift, while trend analysis enables continuous optimization of printing parameters.
  • Closed-loop integration: Optional closed-loop integration with stencil printers and jet printers allows automatic adjustment of the printing process based on SPI data. The same system can also inspect both solder paste and adhesive deposits.

As a core element of the Mycronic 4.0 smart factory approach, the PI Series transforms solder paste printing into a measurable, traceable, and continuously improvable process—helping increase first-pass yield while reducing rework, repair, and scrap costs.

Mycronic’s component placement portfolio consists of flexible, high-capacity pick-and-place solutions designed for modern SMT lines where material and information management are more critical than raw machine speed alone. The MYPro A40 Series and the MY300 family combine high feeder capacity, compact footprint, and a wide component range to maximize productivity—particularly in high-mix environments with frequent product changeovers.

MYPro A40 / A41 Series:

  • Delivers high speed and precision within a compact footprint, following the “fast, small, smart” design philosophy,
  • Achieves placement speeds of up to 59,000 CPH with the A40DX model,
  • Supports larger PCB sizes and higher component diversity with the A41SX / A41DX variants,
  • Covers a broad component range—from 03015 chips to large connectors—using advanced 4K vision systems and both MIDAS (high-precision) and MX7 (high-speed) mounting heads.

MY300 Series:

  • Operates with up to 224 intelligent feeders in a machine footprint up to 40% smaller, enabling “more work on the same line,”
  • Reaches speeds of up to 40,000 CPH, addressing medium- to high-volume production needs,
  • Significantly reduces material handling and setup/changeover times through full traceability, inventory accuracy, and the Agilis™ intelligent feeder system.

Key highlights:

  • High speed and flexibility: Supports a wide component spectrum—from small chips and fine-pitch BGAs/QFNs to modules and odd-shaped components—at high placement speeds.
  • Compact footprint with high feeder capacity: 160–224 feeder positions per machine enable greater product variety with less setup pressure on the same line length.
  • Agilis™ intelligent feeder system: Tool-less, no-moving-part feeders allow rapid loading and replenishment during production, enabling reel changes without stopping the line.
  • Full traceability and integration: Seamless integration with Mycronic 4.0, MYTower intelligent storage, and process software enables component–lot–PCB serial number traceability.

Mycronic’s component placement solutions provide a fast, intelligent, and scalable pick-and-place platform for manufacturers aiming to produce more products, handle more components, and process more work within the same factory footprint—without adding additional machines.

The Mycronic MYPro I Series 3D AOI systems are next-generation, AI-enabled optical inspection platforms that control solder, component, and assembly quality on SMT lines using true 3D measurement. Powered by Iris™ 3D vision technology and AI software, the series adapts to both high-mix production environments and high-speed lines.

With models including MYPro I50 / I50X / I50Xz, I51 / I51z, I81, and I91 / I91z, the portfolio addresses a wide range of use cases—from small, delicate PCBs to thick, heavy boards. Across all models, the common objective is to deliver high inspection coverage, low false-call rates, and high first-pass yield (FPY) without increasing operator workload.

Key features:

  • Advanced 3D imaging – Iris™ 3D: Next-generation cameras and optics provide faster scanning and significantly more detailed 3D images than previous generations. Stable, high-resolution Z-axis measurements across a wide height range enable reliable analysis of even very small solder joints.
  • Comprehensive 3D inspection coverage: SMT components, THT and press-fit elements, and diverse package types can be inspected in 3D both pre- and post-reflow. Each component body, lead/pin, and solder joint is measured independently to reduce defect risk.
  • AI-assisted programming – MYWizard: AI-driven algorithms support component recognition and polarity checks, significantly reducing programming time compared to conventional AOI systems and enabling rapid deployment without reliance on highly specialized programmers.
  • Automatic fine-tuning with Escape Tracker: A real-time performance monitoring tool that identifies weak points in AOI programs and potential sources of escaped defects or unnecessary false calls, making fine-tuning faster, more systematic, and measurable.
  • Deep Review/ADC (Automatic Defect Classification): A deep-learning-based module that automatically classifies detected defects and filters out the majority of false calls in suitable component groups, allowing operators to focus on truly critical issues.
  • High stability and measurement accuracy: Advanced 3D algorithms, vector-based pattern matching, and board-warp compensation mechanisms maintain measurement accuracy even on warped boards, ensuring long-term repeatability and reliability.

The MYPro I Series delivers a line-integrated, AI-powered 3D inspection platform for manufacturers in automotive, defense, medical, and industrial sectors that require near-zero escapes, low false-call rates, and high FPY.

Mycronic MYTower is an automated, vertical component storage system positioned directly next to the SMT line. Its purpose is to replace scattered reel and tray storage on conventional shelves with fast, error-free, and fully traceable management from a single tower.

Designed especially for high-mix production with frequent changeovers, MYTower significantly reduces material search and preparation time.

Key highlights:

  • Compact, line-side storage: The vertical tower design occupies minimal floor space and can be installed directly beside the SMT line, reducing operator travel and shortening setup and changeover times.
  • Automated in/out handling and correct material management: By reading barcodes/IDs on reels or trays, MYTower automatically assigns components to the correct locations and presents the correct material to the operator on request—greatly reducing picking errors and component mix-ups.
  • Fully traceable inventory management: The system records which component, lot number, tower, and position each item occupies, making inventory counts, discrepancy detection, and material location queries faster and more reliable.
  • Optional MSL and humidity-controlled storage: With an integrated dry-air solution, moisture-sensitive components (high MSL levels) can be stored in a controlled environment—supporting compliance and MSL tracking in automotive, defense, aerospace, and medical applications.
  • Brand-independent use and advanced integration: MYTower is designed to operate not only with Mycronic pick-and-place lines but also with SMT machines from other vendors. Integration with material management software, ERP/MES systems, and the Mycronic 4.0 ecosystem enables real-time inventory data to flow directly into production planning.

MYTower transforms the traditional “warehouse + spreadsheets + paper tracking” model into a line-side, intelligent, traceable, and automated component storage solution—reducing material-related downtime and operator workload.

Mycronic’s Process Software (Assembly Process Management) suite comprises end-to-end SMT software solutions designed for factories with high-mix production, frequent NPI, and dynamic production schedules. The objective is to collect data from every point on the line and convert it into actionable insights for traceability, efficiency, quality, and automation.

  • MYCenter Analysis: A centralized dashboard that provides real-time visibility into the entire line, displaying metrics such as current production status, cycle times, and efficiency. It helps identify bottlenecks and defect sources to support line balancing and continuous improvement.
  • MYPro Connect: Connects MYPro equipment to MES/ERP systems via a single IPC-CFX–based interface, enabling centralized management of Industry 4.0 functions such as OEE, FPY, WIP, traceability, and board interlocking.
  • MYPro Link – SPI & AOI Process Control: Consolidates SPI and AOI data into a single web interface, revealing whether defects originate from printing or placement and improving quality, efficiency, and process stability.
  • MYPro Create – Unified Programming Environment: Imports product data (CAD/Gerber) once to generate jobs/recipes for jet printing, 3D SPI, and 3D AOI. It accelerates NPI and changeovers, ensures consistency, and reduces repetitive programming effort.

The Mycronic Process Software suite elevates SMT line data from basic visual reporting to a connected, traceable, and continuously improvable production process.

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